SYSTEM AND METHOD FOR SHAPE MEMORY ALLOY THERMAL INTERFACE
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United States of America Patent
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Oct 22, 2020
app pub date -
Jun 26, 2020
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Apr 21, 2017
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Abstract
An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.
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