Polymeric rule die, and formulations therefor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11130307
APP PUB NO 20200331225A1
SERIAL NO

16737988

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Die and counter-die systems, polymeric rule dies for such systems, and polymeric formulations suitable for producing such rule dies using digital rule writing. There is provided a rule die for pressure-contacting of a cardboard workpiece surface, including: (a) a die body; and (b) at least one elongate polymeric rule, each rule having: (i) a first elongate base surface adhesively attached to a surface of the die body; and (ii) an elongate protrusion, distally protruding from the die body, the elongate protrusion having an elongate die surface, the elongate die surface including a polymeric material, the elongate die surface having a contact surface adapted to contact the workpiece surface; the contact surface having a length of at least 5 mm and a first width (W) within a range of 0.4 to 1.0 mm, the rule having a height (H) within a range of 1.0 to 4.5 mm; wherein, over a total length of the contact surface, the contact surface having at most 5 surface pocks/meter, the pocks having a diameter above 0.1 mm.

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Patent Owner(s)

Patent OwnerAddress
HIGHCON SYSTEMS LTD4 PARAN STREET YAVNE 8122503

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rottman, Claudio Modiin, IL 27 742
Zlotnikov, Natalia Petach Tikva, IL 4 12

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