INJECTION MOLDING APPARATUS AND INJECTION MOLDING METHOD
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United States of America Patent
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Issued Date -
Oct 1, 2020
app pub date -
Jul 5, 2019
filing date -
Mar 29, 2019
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Abstract
An injection molding apparatus including an injection device, a mold, a gas supply device, and a temperature control device is provided. The mold has a mold cavity, wherein the injection device is adapted to inject a material into the mold cavity. The gas supply device is adapted to supply a gas to the mold cavity such that the pressure in the mold cavity is increased. The temperature control device is adapted to control the temperature in the mold cavity. In addition, an injection molding method is also provided.
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