Optical module and optical encoder comprising a dummy light receiving device formed between a light receiving device and a through hole in a sensor substrate

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United States of America Patent

PATENT NO 11112279
APP PUB NO 20200284620A1
SERIAL NO

16807585

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An optical module includes a fixed substrate, and a sensor substrate secured to the fixed substrate and having a through-hole formed therein. A light emitting device is secured to the fixed substrate at a position in the through-hole. A light receiving device is provided in the sensor substrate. A dummy light receiving device is formed between the light receiving device and the through-hole, around the through-hole, and in the sensor substrate. The light receiving device and the dummy light receiving device are made of an impurity diffusion layer having a same conductive type as a conductive type of a surface layer of the sensor substrate. The dummy light receiving device is deeper than the light receiving device.

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Patent Owner(s)

Patent OwnerAddress
MITSUMI ELECTRIC CO LTD2-11-2 TSURUMAKI TAMA-SHI TOKYO 206-8567

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kimura, Shinji Tokyo, JP 160 2512
Ohara, Tomomitsu Tokyo, JP 10 24
Ohba, Yusuke Tokyo, JP 19 75
Suzuki, Syuhei Tokyo, JP 3 16
Tsutsumi, Kazuki Tokyo, JP 1 2

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