PHOTONICS PACKAGE WITH FACE-TO-FACE BONDING
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United States of America Patent
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Issued Date -
Sep 3, 2020
app pub date -
Feb 28, 2019
filing date -
Feb 28, 2019
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Abstract
A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.
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