Tielayer Composition Comprising Polythiol
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United States of America Patent
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Sep 3, 2020
app pub date -
Sep 20, 2018
filing date -
Sep 20, 2017
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Abstract
Disclosed is a tielayer composition having an epoxy-containing compound, a polythiol curing agent, a curing catalyst, and a solvent present in an amount of at least 25% by weight, based on the total weight of the tielayer composition. Also disclosed is a tielayer comprising the tielayer composition in a cured state. Also disclosed is a coated substrate. The substrate has at least one coatable surface and a tielayer formed from the tielayer composition applied to at least one surface of the substrate and cured thereon. The substrate may be footwear. Also disclosed is a method for forming a bond between two substrates.
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