MOLD ASSEMBLY
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United States of America Patent
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Issued Date -
Sep 3, 2020
app pub date -
Mar 1, 2019
filing date -
Mar 1, 2019
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Abstract
An assembly includes a first mold component defining a first portion of a mold cavity and a first slot. The first slot corresponds to a first portion of a retention channel. The assembly also includes a second mold component defining a second portion of the mold cavity and a second slot. The second slot corresponds to a second portion of the retention channel. The assembly also includes a connector having a cross-sectional shape corresponding to a cross-sectional shape of the retention channel. The connector has thermal expansion characteristics that are different from thermal expansion characteristics of the first and second mold components such that when the first and second mold components are in contact and the connector is inserted into the retention channel, heating the assembly causes differential thermal expansion of the connector and the mold components resulting in a clamping force between the mold components.
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