METHODS OF FORMING DEVICES INCLUDING MULTI-PORTION LINERS
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United States of America Patent
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Issued Date -
Aug 27, 2020
app pub date -
May 8, 2020
filing date -
Apr 3, 2014
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Abstract
A method of forming a semiconductor structure. The method comprises forming a protective portion of a liner on at least a portion of stack structures on a substrate. The protective portion comprises a material formulated to adhere to the stack structures. A conformal portion of the liner is formed on the protective portion of the liner or on the protective portion of the liner and exposed materials of the stack structures. At least one of the protective portion and the conformal portion does not comprise aluminum. Additional methods of forming a semiconductor structure are disclosed, as are semiconductor structures including the liners comprising the protective portion and the conformal portion.
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