Integrated Circuits for Flexible Electronics Applications and High-Speed, Stamping-Based Methods of Attaching the Same to an Antenna or Other Substrate
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United States of America Patent
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Issued Date -
Aug 27, 2020
app pub date -
Feb 26, 2020
filing date -
Feb 27, 2019
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Abstract
A method of attaching one or more active devices on one or more substrates to a metal carrier by “hot stamping” is disclosed. The method includes contacting the active device(s) on the substrate(s) with the metal carrier, and applying pressure to and heating the active device(s) on the substrate(s) and the metal carrier sufficiently to affix or attach the active device(s) on the substrate(s) to the metal carrier. The active device(s) may include an integrated circuit. The substrate(s) may include a metal substrate on the backside of the active device and a protective/carrier film on the frontside of the active device. The protective/carrier film may be or include an organic polymer. The metal carrier may be or include a metal foil. Various examples of the method further include thinning the metal substrate, dicing the active device(s) and a continuous substrate, and/or separating the active devices.
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