AQUEOUS ETHYLENE RESIN DISPERSION AND AQUEOUS HEAT SEALING MATERIAL

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United States of America Patent

APP PUB NO 20200270380A1
SERIAL NO

16646757

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Abstract

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Provided is an ethylene-based resin aqueous dispersion that can form a film having excellent airtightness and adhesiveness when applied to a substrate, such as a fiber substrate.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO SEIKA CHEMICALS CO LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MIYAZAKI, Hiromasa Himeji-shi, JP 6 3
MIZUKAWA, Junichi Yachiyo-shi, JP 2 0
OKAMOTO, Masafumi Himeji-shi, JP 19 311
SUGIHARA, Norihiro Osaka-shi, JP 13 57

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