Semiconductor device manufacturing method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11071212
APP PUB NO 20200267845A1
SERIAL NO

16728547

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Importance

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Abstract

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A pressing area set on a main surface of a plate-shaped holding jig is arranged on contact parts. The contact parts are pressed against a multilayer board while heating the multilayer board and the pressing area of the holding jig is inclined with a warp of the multilayer board. In this way, when pressing for bonding the contact parts is performed, even if the multilayer board is warped by the heating and the contact parts are shifted, the contact parts are pressed against the multilayer board without fail.

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Patent Owner(s)

Patent OwnerAddress
FUJI ELECTRIC CO LTDKANAGAWA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wan, Azha Bin Wan Mat Matsumoto, JP 2 2
Yokoyama, Takeshi Matsumoto, JP 72 478

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