Manufacturing method for backlight source
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United States of America Patent
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May 11, 2021
Grant Date -
Aug 20, 2020
app pub date -
Dec 4, 2018
filing date -
Oct 31, 2018
priority date (Note) -
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Abstract
The present invention provides a method for manufacturing a backlight source. The method for manufacturing a backlight source according to the present invention forms a plurality of tin soldering pattern groups on a substrate. Each tin soldering pattern group includes tin soldering patterns spaced from one another, and the tin soldering patterns are in a closed ring shape. The Mini-LEDs are disposed on the tin soldering pattern groups respectively. The substrate is placed in the space having a varying magnetic field. The circuit of the tin soldering patterns in the tin soldering pattern groups generates the induced current for rapid heating and melting, to solder the Mini-LEDs on the substrate. The soldering speed is improved, the process efficiency is high, the process cost is low, and the light effect of the backlight source is effectively ensured.
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