Sputtering target-backing plate assembly
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United States of America Patent
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Dec 27, 2022
Grant Date -
Aug 13, 2020
app pub date -
Jan 28, 2020
filing date -
Feb 12, 2019
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Abstract
A sputtering target-backing plate assembly obtained by bonding a sputtering target and a backing plate using a brazing material, wherein a braze bonding layer which bonds the sputtering target and the backing plate contains a material having thermal conductivity that is higher than that of the brazing material in an amount of 5 vol % or more and 50 vol % or less, and a thickness of the braze bonding layer is 100 μm or more and 700 μm or less. An object is to prevent the seepage of the brazing material while maintaining the thickness of the braze bonding layer.
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