Method and system for tin immersion and soldering of core wire
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United States of America Patent
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Dec 6, 2022
Grant Date -
Aug 13, 2020
app pub date -
Dec 14, 2017
filing date -
Oct 30, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed are a method and a system for tin immersion and soldering of a core wire which includes: inserting a core wire row into molten tin vertically; moving the each core wire in the molten tin along a direction perpendicular to the core wire row to remove carbonized matter from each core wire on a moving direction side; pulling the each core wire out of the molten tin; and performing alignment, such that the inner core conductor of the each core wire on the moving direction side contacts with a bonding pad. According to the technical solution of the present disclosure, the carbonized matter on the core wire that aligned facing the bonding pad is removed, such that the temperature transfer effect of the automatic soldering is improved, the yield of the automatic soldering is improved, and the consistency and the yield of the automatic soldering are more stable.
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