Soldering method and soldering apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11059117
APP PUB NO 20200254549A1
SERIAL NO

16696907

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Importance

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Abstract

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To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput.

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Patent Owner(s)

Patent OwnerAddress
SENJU METAL INDUSTRY CO LTD23 SENJU-HASHIDO-CHO ADACHI-KU TOKYO 120-8555
SENJU SYSTEM TECHNOLOGY CO LTD1-4 FUCHUMACHISHIMAHONGO TOYAMA-SHI TOYAMA 939-2708

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hashimoto, Noboru Toyama, JP 30 316
Kasama, Takahiro Toyama, JP 3 5

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