FILM FORMATION APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20200240038A1
SERIAL NO

16736886

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Abstract

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A film formation apparatus is configured to epitaxially grow a film on a surface of a substrate, and the film formation apparatus may include: a stage configured to allow the substrate to be mounted thereon; a heater configured to heat the substrate; a mist supply source configured to supply mist of a solution that comprises a solvent and a material of the film dissolved in the solvent; a heated-gas supply source configured to supply heated gas that comprises gas constituted of a same material as a material of the solvent and has a higher temperature than the mist; and a delivery device configured to deliver the mist and the heated gas to the surface of the substrate.

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Patent Owner(s)

Patent OwnerAddress
DENSO CORPORATIONKARIYA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NAGAOKA, Tatsuji Nagakute-shi, JP 71 1305
NISHINAKA, Hiroyuki Kyoto-shi, JP 23 14
TAHARA, Daisuke Kyoto-shi, JP 36 70
YOSHIMOTO, Masahiro Kyoto-shi, JP 44 139

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