INDIUM ELECTROPLATING COMPOSITIONS AND METHODS FOR ELECTROPLATING INDIUM ON NICKEL
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United States of America Patent
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Jul 30, 2020
app pub date -
Jan 25, 2019
filing date -
Jan 25, 2019
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Abstract
Indium electroplating compositions electroplate substantially defect-free, whisker-free, uniform indium layers which have a smooth surface morphology on nickel. The indium electroplating compositions are environmentally friendly and include select amino acids to provide for the smooth, uniform and defect-free indium deposits.
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