HINGED LAMINATED BODY, LAYOUT SHEET FOR HINGED LAMINATED BODY, AND MANUFACTURING METHOD FOR HINGED LAMINATED BODY

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United States of America Patent

APP PUB NO 20200230993A1
SERIAL NO

16840582

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A thin hinged laminated body and a layout sheet for the hinged laminated body are provided. A hinged laminated body, equipped with: an IC module having an IC chip capable of performing contactless communication; a hinge layer having a hinge sectiones which can be bound into a booklet; a non-hinge layer which is laminated onto the hinge layer and does not have a hinge part, wherein the hinge layer is disposed over the entire surface of the laminated body having the hinge, the hinge layer and the non-hinge layer have a housing hole penetrating across the two layers, and the IC module is housed and held inside the housing hole.

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Patent Owner(s)

Patent OwnerAddress
DAI NIPPON PRINTING CO LTDTOKYO JAPAN TOKYO METROPOLIS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Motoi, Takumi Tokyo, JP 14 20
Nishioka, Toru Tokyo, JP 42 557

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