ADHESIVELY JOINED COOLING PLATE
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United States of America Patent
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Issued Date -
Jul 16, 2020
app pub date -
Jan 10, 2019
filing date -
Jan 10, 2019
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Abstract
In an embodiment, a cooling plate comprises a first substrate and a second substrate; wherein the first substrate and the second substrate are adhesively bonded via an adhesive layer; wherein a conduit is formed between the first substrate and the second substrate having an inlet and an outlet that forms a flow field for a coolant to flow through; wherein the adhesion layer forms a tight fluid seal to prevent leakage of the coolant from the conduit to a bonded region proximal to the conduit area between the first substrate and the second substrate.
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