HARD MASK AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

United States of America Patent

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Jul 16, 2020
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Jan 15, 2020
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Jan 16, 2019

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Abstract

There is provided a hard mask formed on a substrate for manufacturing a semiconductor device, the hard mask including a film made of a compound which is composed of Ru and an element selected from Ti, Zr, Hf, V, Nb, Ta, Mo, W, and Si.

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Patent Owner	Address
TOKYO ELECTRON LIMITED	3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

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Inventor Name	Address	# of filed Patents	Total Citations
FURUKAWA, Shinji	Tokyo, JP	47	290
ISHIBASHI, Shota	Nirasaki City, JP	17	18
TOSHIMA, Hiroyuki	Nirasaki City, JP	33	404

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HARD MASK AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

16743466

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16743466

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