WAFER CRACK DETECTION
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United States of America Patent
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Jul 16, 2020
app pub date -
Jan 16, 2020
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Jan 16, 2019
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Abstract
A method for identifying cracks in non-planar substrates is herein disclosed. Images of a substrate in a relaxed state are captured and assessed to identify cracks, if any. Assessment may be conducted optically using broad band illumination, laser illumination, or infrared illumination. Mechanisms for carrying out the method are also disclosed.
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