LIQUID-HEATED MOLD AND METHOD OF USING SME
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United States of America Patent
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Jul 9, 2020
app pub date -
May 15, 2018
filing date -
May 24, 2017
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Abstract
The present system is configured to absorb, using a fluid medium in a reservoir, electromagnetic radiation to heat the fluid medium. The fluid medium may then conduct heat into a mold cavity formed by interior mold surfaces of at least two mold pieces. The fluid medium may heat up to, but not beyond, a phase transition temperature of the fluid medium, reducing instances of accidental damage to moldable material in a mold cavity during thermally-accelerated curing of the moldable material. In some instances a mold may be placed in liquid contained by the reservoir. In some instances, a mold may have integral reservoirs in individual mold pieces.
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