ADHESIVE FILM, SEMICONDUCTOR APPARATUS USING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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United States of America Patent
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Issued Date -
Jul 2, 2020
app pub date -
Aug 14, 2019
filing date -
Dec 28, 2018
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Abstract
An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.
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