Differential Pressure Sensor and Fabrication Method Therefor
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United States of America Patent
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Issued Date -
Jul 2, 2020
app pub date -
Apr 7, 2017
filing date -
Apr 7, 2017
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Abstract
A differential pressure sensor, wherein a gas pipeline (12) is formed in an IC carrier plate (10) and two air holes (13) in communication with the gas pipeline (12) are arranged on the top surface of the IC carrier plate (10). A pressure sensing chip (30) is integrated with one of the air holes (13) on the IC carrier plate (10), and an upper cover (40) is adhered and combined on the top surface of the IC carrier plate (10); two cavities (411) are arranged on the upper cover (40) and correspond to the positions of the two air holes (13), and two air pipes (42) respectively connected to the cavities (411) are arranged on the upper cover (40). When in use, the present invention is combined with a circuit board and guided by the two air holes (13) and the gas pipeline (12), so that the front and the back sides of the pressure sensing chip (30) simultaneously sense high-pressure gas and low-pressure gas inputted by the two air pipes (42), and the functions of electrical signal transmission and gas pressure transmission are carried out by using mature and mass-produced IC carrier plate (10) technology, thereby greatly reducing the difficulty and cost of fabrication.
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