Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same
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United States of America Patent
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May 23, 2023
Grant Date -
Jun 25, 2020
app pub date -
Dec 18, 2019
filing date -
Dec 20, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B29B:PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE ....
- B29K:INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, ....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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