Thick-film resistive element paste and use of thick-film resistive element paste in resistor

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United States of America Patent

PATENT NO 11136257
APP PUB NO 20200189960A1
SERIAL NO

16640441

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This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.

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Patent Owner(s)

Patent OwnerAddress
KOA CORPORATION3672 ARAI INA-SHI NAGANO 396-0025

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iguchi, Natsuki Nagano, JP 6 26
Iguchi, Yuya Nagano, JP 2 2
Urano, Koichi Nagano, JP 7 114

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