Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components
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United States of America Patent
Stats
-
Nov 29, 2022
Grant Date -
Jun 11, 2020
app pub date -
Feb 11, 2020
filing date -
Nov 8, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.
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- B23K Class
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Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | May 29, 2026 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 29, 2030 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 29, 2034 |
