ALUMINUM ALLOY SPUTTERING TARGET
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United States of America Patent
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Issued Date -
Jun 11, 2020
app pub date -
Oct 26, 2017
filing date -
Nov 30, 2016
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Abstract
Disclosed is an aluminum alloy sputtering target containing 0.01 atomic % to 0.04 atomic % in total of at least one element selected from the group consisting of Ni, Cr, Fe, Co and Cu, and 0.01 atomic % to 0.06 atomic % in total of at least one element selected from rare earth elements other than La, the balance being Al and inevitable impurities.
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