Wave solder pallets for optimal solder flow and methods of manufacturing
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United States of America Patent
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Dec 26, 2023
Grant Date -
Jun 11, 2020
app pub date -
Feb 11, 2020
filing date -
Nov 8, 2016
priority date (Note) -
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Abstract
A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.
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