HEAT TRANSFER DEVICE FOR PRODUCING A SOLDERED CONNECTION OF ELECTRICAL COMPONENTS
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United States of America Patent
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Issued Date -
Jun 11, 2020
app pub date -
Feb 10, 2020
filing date -
Dec 9, 2014
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Abstract
A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.
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