MASK BLANK, METHOD OF MANUFACTURING TRANSFER MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20200166833A1
SERIAL NO

16615542

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A mask blank includes a light shielding film for forming a transfer pattern, provided on a transparent substrate. The light shielding film is made of a material that consists of silicon and nitrogen or that further includes one or more elements selected from a metalloid element and a non-metallic element. In an inner region of the light shielding film (excluding a vicinity region of an interface of the light shielding film with the transparent substrate and a surface layer region of the light shielding film opposite the transparent substrate), the ratio of Si3N4 bonds to the total number of Si3N4 bonds, SiaNb bonds (where a relationship b/[a+b]<4/7 is satisfied), and Si—Si bonds is 0.04 or less, and the ratio of SiaNb bonds to the total number of Si3N4 bonds, SiaNb bonds, and Si—Si bonds is 0.1 or more.

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Patent Owner(s)

Patent OwnerAddress
HOYA CORPORATIONTOKYO
HOYA ELECTRONICS SINGAPORE PTE LTD10 TAMPINES INDUSTRIAL CRECENT SINGAPORE 528603

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HASHIMOTO, Masahiro Tokyo, JP 99 970
UCHIDA, Mariko Singapore, SG 12 10

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