CIRCUIT BOARD PRODUCTION METHOD, CIRCUIT SHEET AND CIRCUIT BOARD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20200163221A1
SERIAL NO

16603997

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Abstract

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A circuit board production method, the method comprising a process of disposing a circuit sheet on a substrate, the circuit sheet comprising circuits and a resin portion disposed at spaces between the circuits.

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Patent Owner(s)

Patent OwnerAddress
HITACHI CHEMICAL COMPANY LTD9-2 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 1006606 ?1006606

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AMANUMA, Shinji Chiyoda-ku, Tokyo, JP 3 0
KIGUCHI, Kazuya Chiyoda-ku, Tokyo, JP 10 6
MIYAZAKI, Yasuo Chiyoda-ku, Tokyo, JP 17 127
NAKAMURA, Yuki Chiyoda-ku, Tokyo, JP 266 1409
NISHIYAMA, Tomoo Chiyoda-ku, Tokyo, JP 15 69
TAKEZAWA, Yoshitaka Chiyoda-ku, Tokyo, JP 79 431
TOGAWA, Mitsuo Chiyoda-ku, Tokyo, JP 2 11

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