MICROMECHANICAL COMPONENT
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United States of America Patent
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Issued Date -
May 21, 2020
app pub date -
Nov 12, 2019
filing date -
Nov 15, 2018
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Abstract
A micromechanical component having a movable seismic mass developed in a second and third silicon functional layer, a hollow body being developed in the second and third silicon functional layers, which has a cover element developed in a fourth silicon functional layer.
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