Thermal interface adhesion for transfer molded electronic components
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United States of America Patent
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Oct 5, 2021
Grant Date -
May 14, 2020
app pub date -
Jan 19, 2020
filing date -
Mar 3, 2016
priority date (Note) -
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Abstract
An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.
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