Apparatus for automatically clearing residual solder paste with a gas channel in the working platform bearing a solder paste tub
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United States of America Patent
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Jul 27, 2021
Grant Date -
May 14, 2020
app pub date -
Apr 13, 2018
filing date -
Apr 14, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
The present application provides an apparatus for automatically clearing away residual solder paste, comprising: a working platform for bearing a solder paste tub accommodating a solder paste nozzle, the solder paste nozzle having a solder paste nozzle mouth, the working platform having a solder paste through-hole for accommodating the solder paste nozzle mouth; and a gas channel disposed in the working platform, the gas channel comprising a gas inlet and a gas outlet, the gas inlet being configured to be in communication with a cleaning gas source, and the gas outlet being configured to blow gas towards the solder paste nozzle mouth accommodated in the solder paste through-hole, thereby cutting solder paste remaining at the solder paste nozzle mouth.
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