Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same
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United States of America Patent
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Jul 18, 2023
Grant Date -
May 7, 2020
app pub date -
Dec 20, 2019
filing date -
Jun 21, 2017
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Abstract
A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1,
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