Composition for inorganic molded article production use, and method for producing inorganic molded article
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United States of America Patent
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May 7, 2024
Grant Date -
May 7, 2020
app pub date -
Dec 20, 2019
filing date -
Jun 23, 2017
priority date (Note) -
In Force
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Abstract
A resin composition for inorganic molded article production use, which is provided with inorganic particles each containing amorphous SiO2 and a photocurable resin composition, in which the photocurable resin composition contains a photocurable resin precursor and a photopolymerization initiator, the content of the inorganic particles is 60% by mass or more with respect to the total amount of the photocurable resin composition and the inorganic particles and is 60% by mass or more with respect to the entire amount of the resin composition for inorganic molded article production use, and the viscosity of the composition for inorganic molded article production use is 10000 mPa·s or less.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
KYUSHU UNIVERSITY NATIONAL UNIVERSITY CORPORATION | FUKUOKA-SHI FUKUOKA |
International Classification(s)

- 2019 Application Filing Year
- C03C Class
- 943 Applications Filed
- 575 Patents Issued To-Date
- 60.98 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Fujino, Shigeru | Fukuoka, JP | 18 | 57 |
# of filed Patents : 18 Total Citations : 57 |
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- 0 Citation Count
- C03C Class
- 0 % this patent is cited more than
- 1 Age
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