1 GPA HIGH-STRENGTH HIGH-MODULUS ALUMINUM-BASED LIGHT MEDIUM-ENTROPY ALLOY AND PREPARATION METHOD THEREOF

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United States of America Patent

APP PUB NO 20200123635A1
SERIAL NO

16656843

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A 1 GPa high-strength high-modulus aluminum-based light medium-entropy alloy and a preparation method thereof. An atomic expression of the designed medium-entropy alloy is AlxLiyMgzZnuCuv, subscripts representing the molar percentage of each corresponding alloy element, where x+y+z+u+v=100, x is 79.5-80.5, y is 1.5-2.5, z is 1.5-2.5, u is 13.5-14.5, and v is 1.5-2.5. The phase structure of the involved alloy is mainly based on a face-centered cubic (FCC) solid solution. The present invention obtains high performance aluminum alloy ingots through vacuum induction smelting and direct casting, and features low energy consumption, decreased cost, and simple operation in the preparation process, which cater to the high requirements on cost, strength and plasticity of light alloys applied in the high-end manufacturing industries such as aerospace and automobile electronics nowadays.

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Patent Owner(s)

Patent OwnerAddress
UNIVERSITY OF SCIENCE & TECHNOLOGY BEIJINGHAIDIAN DISTRICT BEIJING 100083
DONGGUAN YONGTAO NEW MATERIAL TECHNOLOGY CO LTDROOM D E AND F FLOOR 4 NO 11 ZHENGTONG ROAD SALIAN VILLAGE FENGGANG TOWN DONGGUAN CITY GUANGDONG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Ruixuan Beijing, CN 2 1
Li, Yangde Beijing, CN 24 50
Zhang, Tao Beijing, CN 1018 9317
Zhang, Yong Beijing, CN 774 4505

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