Light- or heat-curing method and curable resin composition

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United States of America Patent

PATENT NO 11548984
APP PUB NO 20200123324A1
SERIAL NO

16622132

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Abstract

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An object of the present invention is to provide a light- or heat-curing method by which a cured product (crosslinked product or resin) can be prepared in a simple method even in a case where filler is contained in a large amount; a curable resin composition which is used in the curing method; and the like.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM WAKO PURE CHEMICAL CORPORATION1-2 DOSHOMACHI 3-CHOME CHUO-KU OSAKA-SHI OSAKA 5408605

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imazeki, Shigeaki Saitama, JP 11 72
Nakano, Tadashi Tokyo, JP 61 689
Sakai, Nobuhiko Saitama, JP 11 56
Yanaba, Kosuke Saitama, JP 8 26

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