OPTICAL SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME

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United States of America

APP PUB NO 20200098567A1
SERIAL NO

16571934

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Abstract

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A method of manufacturing an optical semiconductor element includes: stacking a plurality of compound semiconductor layers on a first substrate containing a compound semiconductor; dividing the first substrate into small pieces; forming terraces, grooves, walls, and a first mesa for a waveguide on a second substrate containing silicon; jointing at least one small piece to the second substrate after the forming; wet-etching the first substrate so as to expose the compound semiconductor layers after the jointing; and forming a second mesa opposite to the first mesa from the compound semiconductor layers; wherein the grooves are formed on both sides of the first mesa, the terraces are formed on both sides of the first mesa and the grooves, and the walls are arranged in an extending direction of each groove.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kikuchi, Takehiko Osaka, JP 35 62
Nishiyama, Nobuhiko Tokyo, JP 22 172
Seki, Morihiro Osaka, JP 9 67

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