METHOD FOR THERMALLY DEVELOPING RELIEF PRECURSORS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200094541A1
SERIAL NO

16577296

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Abstract

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A method for thermally developing a relief precursor comprising a supporting layer and photopolymer layer having cured and uncured portions comprising the steps:

    (a) fixing the relief precursor with the supporting layer adjacent to a movable support;(b) repeatedly moving the support with the relief precursor fixed thereon in a multitude of movement cycles;(c) heating the relief precursor to a temperature sufficient to cause the uncured portions of the photopolymer layer to soften or liquefy;(d) contacting the relief precursor with a development medium to allow the liquefied material of the uncured portions to be adhered to and removed by the development medium;wherein the heating and contacting is carried out in cycles A, B, C or D each corresponding to a single movement cycle such that(i) in a cycle A, the relief precursor is heated with higher heating power and not contacted the relief precursor with the development medium;(ii) in a cycle B, the relief precursor is heated with higher heating power and contacted with the development medium;(iii) in a cycle C, the relief precursor is not heated or heated with lower heating power and contacted with the development medium;(iv) in a cycle D, the relief precursor is not heated or heated with lower heating power and not contacted with the development medium;wherein cycle B is carried out once or more and at least one of cycles A, C or D is carried out once or more.

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Patent Owner(s)

Patent OwnerAddress
XSYS GERMANY GMBHINDUSTRIESTRASSE 1 WILLSTÄTT 77731

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FRONCZKIEWICZ, Peter Lake Wylie, US 3 16
KNAPP, Andrew Charlotte, US 6 25
KUNZ, Martin Waldbronn, DE 49 574
WENDLAND, Torben Renningen, DE 2 0

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