THIN, HIGH-STIFFNESS LAMINATES, PORTABLE ELECTRONIC DEVICE HOUSINGS INCLUDING THE SAME, AND METHODS FOR MAKING SUCH LAMINATES AND PORTABLE ELECTRONIC DEVICE HOUSINGS
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United States of America
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Mar 26, 2020
app pub date -
Mar 19, 2018
filing date -
Mar 19, 2018
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Abstract
The present disclosure includes thin, high-stiffness laminates, portable electronic device housings including the same, and methods for making such laminates and portable electronic device housings. Some laminates include two or more laminae, each having fibers dispersed within a matrix material, wherein the laminate has a width, a length that is perpendicular to the width, the length being between approximately 1.25 and approximately 1.80 times the width, a thickness that is perpendicular to each of the width and the length, the thickness being between approximately 1.0 mm and approximately 1.5 mm, and a first flexural rigidity along the width and a second flexural rigidity along the length, the second flexural rigidity being 10 to 30 times the first flexural rigidity.
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