Wire Automatic Soldering System
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Mar 26, 2020
app pub date -
Nov 15, 2019
filing date -
Nov 15, 2019
priority date (Note) -
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Abstract
A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
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