HIGH DEFINITION STENCIL
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Mar 5, 2020
app pub date -
Nov 7, 2019
filing date -
Nov 7, 2019
priority date (Note) -
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Abstract
A stencil for use in stenciling complex symbols incorporates a stencil substrate employing a flexible material, having a plurality of symbols arranged thereon. A plurality of folding stiffeners are incorporated in the substrate, each stiffener being positioned to split symbols having stencil cutouts forming isolated elements within an interior of the symbol. The stiffeners are foldable about a vertex, to collapse into a raised position and bring together the split symbol, with the stiffeners supporting the isolated elements created by the cutouts and portions of the stencil cutouts forming the symbols that extend into coincident channels in the folding stiffeners, to bridge adjoining portions of said split characters.
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