ELECTRONIC MODULE AND METHOD FOR THE PRODUCTION THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Feb 27, 2020
app pub date -
Oct 24, 2017
filing date -
Oct 24, 2017
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An electronics module may include at least one power semiconductor that is connected in a thermally conductive manner to an integral heat sink. The electronics module may further include a turbulence element that can move in a laser sintered cooling channel of the heat sink. The turbulence element may be laser sintered with the heat sink in a common laser sintering process.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully