Photosensitive Resin and Manufacturing Method Thereof

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200055972A1
SERIAL NO

16599550

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Abstract

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Various embodiments disclosed relate to photopolymerizable compositions that are suitable for making three-dimensional structures when exposed to laser light.

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Patent Owner(s)

Patent OwnerAddress
DHG HOLDINGS LTD1A GARFORTH PLACE KNOWLHILL MILTON KEYNES BUCKINGHAMSHIRE MK5 8PG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Qin, Tina Van Nuys, US 28 405
Wiensch, Joshua D Pasadena, US 28 417

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