METHOD FOR BONDING SEPARATORS, METHOD FOR MANUFACTURING ELECTROCHEMICAL DEVICE, AND ELECTROCHEMICAL DEVICE
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United States of America
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Feb 13, 2020
app pub date -
Dec 27, 2017
filing date -
Dec 27, 2017
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Abstract
A method for bonding separators (3) having a multilayer structure that comprises a substrate layer (3a) and a ceramic layer (3b), the ceramic layer (3b) being laminated on at least one surface of the substrate layer (3a) and having higher heat resistance properties than the substrate layer (3a), the method comprising steps of: applying an adhesive member (10) onto the ceramic layer (3b) and then peeling off the adhesive member (10) to remove a portion of the ceramic layer (3b) together with the adhesive member (10); and heating a portion of the separator (3), from which the ceramic layer (3b) has been removed, to heat-weld the separator (3) to other separator (3).
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