INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
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United States of America
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Jan 23, 2020
app pub date -
Sep 30, 2019
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Sep 30, 2019
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Abstract
An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer
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