GATE STRUCTURE OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
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United States of America
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Issued Date -
Jan 9, 2020
app pub date -
Jul 3, 2018
filing date -
Jul 3, 2018
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Abstract
A gate structure of a semiconductor device, includes: a trench gate and a planar gate including a plurality of polysilicon structures (406) separated from each other; the gate structure of the semiconductor device further includes a well region (503) being adjacent to the trench gate and being disposed under the planar gate; a first conduction type doped region (504) being disposed in the well region (503) and including a plurality of regions separated from each other, wherein each region is disposed under adjacent polysilicon structures (406), and respective regions are electrically connected to the planar gate; and a source (504a) being disposed in the well region (503); wherein the trench gate includes: a silicon oxide filler (202) including a side wall silicon oxide and a bottom silicon oxide; a control gate (402) being located over the trench gate, wherein a side wall of the control gate is enclosed by the side wall silicon oxide, and the control gate (402) is electrically-connected to the planar gate; a shield gate (404) having a single segment structure or a longitudinally arranged multiple segments structure; and an insulation silicon oxide (204) being filled between adjacent control gate and shield gate in vertical direction.
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