Conductive Adhesive

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200002582A1
SERIAL NO

16484913

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Abstract

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The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×104 Pa to 4.0×105 Pa.

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Patent Owner(s)

Patent OwnerAddress
TATSUTA ELECTRIC WIRE & CABLE CO LTD3-1 IWATA-CHO 2-CHOME HIGASHIOSAKA-SHI OSAKA 5788585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AOYAGI, Yoshihiko Kizugawa-shi, Kyoto, JP 8 13
ISOBE, Osamu Kizugawa-shi, Kyoto, JP 13 74
KAMINO, Kenji Kizugawa-shi, Kyoto, JP 12 67

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